Retail Packaging Design and Prototype Experts
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NUESKU MEDIA ROOM
For Immediate Release Contact: Rob Handberg,
1.888.751.9079 Nuesku will sponsor 2011 The Dieline Package Design Conference in Chicago EAGAN, Minn. (April 28, 2011) – NueSku, a custom retail packaging design and engineering company, will be a first time sponsor of The Dieline Package Design Conference presented by HOW on June 22-24, 2011 at the Hyatt Regency Hotel Chicago. The conference provides an opportunity for all professionals involved with package design to share ideas and industry trends under one roof. “From everything we’ve heard from the industry, this conference will be an excellent opportunity for NueSku to speak with top professionals charged with developing leading consumer brand packaging,” said Rob Handberg, NueSku general manager. “We’re excited to showcase our design and engineering capabilities as well as connect with other industry leaders.” Nuesku’s professional engineers deliver creative ways to secure, display and differentiate clients’ retail products from competitors. Nuesku designs and generates 2D and 3D renderings, builds prototype tooling, creates four color graphic packaging mock-ups, and provides all engineering files and documentation to generate production volume packaging. Nuesku is a premier packaging design and engineering company with a strong track record of developing innovative and trendy retail packaging. Conference Information Dates: June 22-24, 2011 151 E. Wacker Drive Chicago, IL 60601 ### About NueSku Nueksu’s specialties include retail
packaging design, rapid prototyping services and 3D virtual mockups.
Its rapid prototyping capabilities include blister and clamshell packs,
corrugated displays, folding cartons, die-line design, 3D modeling,
3D scanning, and full graphic prototypes. For more information,
visit www.nuesku-packaging.com or call 1.888.751.9079. |
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